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合木智能 funding history

1 recorded financing disclosures for 合木智能. Dates, rounds, currencies and original sources follow the individual records. This is not a complete company funding history.

Latest recorded funding, at a glance

The latest disclosure recorded for 合木智能 is dated 2026-09-03: Seed, CNY 10,000,000–100,000,000 (reported range). Named investors: 创新工场. This is the latest record in our coverage, not a claim about all company financing.

Verify this disclosure · Original source 1 · Original source 2

Disclosures and evidence

Disclosure dateRoundDisclosed amountNamed investorsEvidence
SeedCNY 10,000,000–100,000,000 (reported range)创新工场Record · Source 1 · Source 2

Recorded financing disclosures

Disclosed investors across recorded rounds

Publicly disclosed founding team

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