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天鹜科技 funding history

1 recorded financing disclosures for 天鹜科技. Dates, rounds, currencies and original sources follow the individual records. This is not a complete company funding history.

Latest recorded funding, at a glance

The latest disclosure recorded for 天鹜科技 is dated 2026-07-13: Series A++, CNY 200,000,000–900,000,000 (reported range). Named investors: 上海国投先导, 国投创新, 聚杰微纤, 宁波甬元兴仑君金创投, 金景资本, 孚腾资本, 财鑫资本. This is the latest record in our coverage, not a claim about all company financing.

Verify this disclosure · Original source 1 · Original source 2 · Original source 3

Disclosures and evidence

Disclosure dateRoundDisclosed amountNamed investorsEvidence
Series A++CNY 200,000,000–900,000,000 (reported range)上海国投先导, 国投创新, 聚杰微纤, 宁波甬元兴仑君金创投, 金景资本, 孚腾资本, 财鑫资本Record · Source 1 · Source 2 · Source 3

Recorded financing disclosures

Disclosed investors across recorded rounds

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