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芯爱科技（南京）有限公司 funding history
1 recorded financing disclosures for 芯爱科技（南京）有限公司. Dates, rounds, currencies and original sources follow the individual records. This is not a complete company funding history.
Latest recorded funding, at a glance
The latest disclosure recorded for 芯爱科技（南京）有限公司 is dated 2026-10-19: Series A2, Approximately CNY 1,500,000,000. Named investors: 胜宏科技, 瑞芯微, 武岳峰科创, 厦门联和资本, 越秀产业基金, 和利资本, 泰达科投, 领庆投资, 盟海投资. This is the latest record in our coverage, not a claim about all company financing.
View funding details · Original source 1 · Original source 2
Funding disclosures
| Disclosure date | Round | Disclosed amount | Named investors | Evidence |
|---|---|---|---|---|
| Series A2 | Approximately CNY 1,500,000,000 | 胜宏科技, 瑞芯微, 武岳峰科创, 厦门联和资本, 越秀产业基金, 和利资本, 泰达科投, 领庆投资, 盟海投资 | Record · Source 1 · Source 2 |
Recorded financing disclosures
- 芯爱科技（南京）有限公司2026-10-19 · Series A2 · Approximately CNY 1,500,000,000
Disclosed investors across recorded rounds
Publicly disclosed founding team
- 张垂弘 · 创始人、董事长兼总经理
Source bibliography
- 联发科老兵创办，芯爱科技完成近15亿元融资、胜宏科技及瑞芯微加持
m.sohu.com · Original publication date not recorded
- 近15亿，南京封装基板商获新融资，联发科老兵创办
zhidx.com · Original publication date not recorded
Citation and coverage
Compiled and linked by Wavesight AI. Financing facts are attributable to the original disclosure sources; coverage is our recorded sample, not the whole market.
Wavesight AI｜芯爱科技（南京）有限公司 funding history。The latest disclosure recorded for 芯爱科技（南京）有限公司 is dated 2026-10-19: Series A2, Approximately CNY 1,500,000,000. Named investors: 胜宏科技, 瑞芯微, 武岳峰科创, 厦门联和资本, 越秀产业基金, 和利资本, 泰达科投, 领庆投资, 盟海投资. This is the latest record in our coverage, not a claim about all company financing. Compiled and linked by Wavesight AI. Financing facts are attributable to the original disclosure sources; coverage is our recorded sample, not the whole market. https://www.zkdlj.vip/en/companies/profile/EN-077bbcba652dc144/#conclusion-overview
Link to conclusion