AI CAPITAL INTELLIGENCE
秋水半导体 funding history
1 recorded financing disclosures for 秋水半导体. Dates, rounds, currencies and original sources follow the individual records. This is not a complete company funding history.
Latest recorded funding, at a glance
The latest disclosure recorded for 秋水半导体 is dated 2026-05-29: Multiple rounds, Approximately CNY 200,000,000. Named investors: 朝晖资本, 通商基金, 盛宇投资, 宁波人才发展基金, 嘉溢创投, 涌现科技, 数字光芯, 兴棠资本. This is the latest record in our coverage, not a claim about all company financing.
Verify this disclosure · Original source 1 · Original source 2
Disclosures and evidence
| Disclosure date | Round | Disclosed amount | Named investors | Evidence |
|---|---|---|---|---|
| Multiple rounds | Approximately CNY 200,000,000 | 朝晖资本, 通商基金, 盛宇投资, 宁波人才发展基金, 嘉溢创投, 涌现科技, 数字光芯, 兴棠资本 | Record · Source 1 · Source 2 |
Recorded financing disclosures
- 秋水半导体2026-05-29 · Multiple rounds · Approximately CNY 200,000,000
Disclosed investors across recorded rounds
Publicly disclosed founding team
- 蒋振宇 · 创始人