AI CAPITAL INTELLIGENCE
秋水半导体 · Multiple rounds · Approximately CNY 200,000,000 · 2026-05-29
Financing facts, at a glance
秋水半导体: financing disclosed on 2026-05-29, Multiple rounds, Approximately CNY 200,000,000. Named investors: 朝晖资本, 通商基金, 盛宇投资, 宁波人才发展基金, 嘉溢创投, 涌现科技, 数字光芯, 兴棠资本. This is the amount disclosed for the financing, not a company valuation or an individual investor commitment.
秋水半导体 is recorded in the Consumer AI devices / AI glasses segment. The disclosed financing is Multiple rounds, with an amount of Approximately CNY 200,000,000. Named investors include 朝晖资本, 通商基金, 盛宇投资, 宁波人才发展基金, 嘉溢创投, 涌现科技, 数字光芯, 兴棠资本.
- Disclosed company name
- 秋水半导体
- Disclosure date
- 2026-05-29
- Round
- Multiple rounds
- Financing amount
- Approximately CNY 200,000,000
- Market coverage
- China
- Sector
- Consumer AI devices / AI glasses
- Product form
Disclosed investors
朝晖资本, 通商基金, 盛宇投资, 宁波人才发展基金, 嘉溢创投, 涌现科技, 数字光芯, 兴棠资本
Original sources
Record reviewed as of . Reported ranges and lower bounds are retained. Financing proceeds are not company valuation.