AI CAPITAL INTELLIGENCE
壁仞科技 · Multiple rounds · Lower bound: CNY 5,000,000,000 · 2024-09-12
Financing facts, at a glance
壁仞科技: financing disclosed on 2024-09-12, Multiple rounds, Lower bound: CNY 5,000,000,000. Named investors: 上海国投先导人工智能产业母基金. This is the amount disclosed for the financing, not a company valuation or an individual investor commitment.
Original source 1 · Original source 2 · Original source 3 · Original source 4 · Original source 5 · Original source 6 · Original source 7
壁仞科技 is recorded in the AI compute & chips / AI chips & accelerators segment. The disclosed financing is Multiple rounds, with an amount of Lower bound: CNY 5,000,000,000. Named investors include 上海国投先导人工智能产业母基金.
- Disclosed company name
- 上海壁仞科技股份有限公司
- Disclosure date
- 2024-09-12
- Round
- Multiple rounds
- Financing amount
- Lower bound: CNY 5,000,000,000
- Market coverage
- China
- Sector
- AI compute & chips / AI chips & accelerators
- Product form
- Chips & compute systems
Disclosed investors
上海国投先导人工智能产业母基金
Original sources
- Source 1 · www.cls.cn
- Source 2 · birentech.com
- Source 3 · 36kr.com
- Source 4 · www.eefocus.com
- Source 5 · 36kr.com
- Source 6 · 36kr.com
- Source 7 · www.36kr.com
Record reviewed as of . Reported ranges and lower bounds are retained. Financing proceeds are not company valuation.