AI CAPITAL INTELLIGENCE
亿铸科技 funding history
1 recorded financing disclosures for 亿铸科技. Dates, rounds, currencies and original sources follow the individual records. This is not a complete company funding history.
Latest recorded funding, at a glance
The latest disclosure recorded for 亿铸科技 is dated 2026-10-23: Undisclosed round, Lower bound: CNY 1,000,000,000. Named investors: Not disclosed. This is the latest record in our coverage, not a claim about all company financing.
View funding details · Original source 1 · Original source 2 · Original source 3
Funding disclosures
| Disclosure date | Round | Disclosed amount | Named investors | Evidence |
|---|---|---|---|---|
| Undisclosed round | Lower bound: CNY 1,000,000,000 | Not disclosed | Record · Source 1 · Source 2 · Source 3 |
Recorded financing disclosures
- 亿铸科技2026-10-23 · Undisclosed round · Lower bound: CNY 1,000,000,000
Publicly disclosed founding team
- 熊大鹏 · 创始人、董事长兼CEO
Source bibliography
- 芯片公司亿铸科技宣布完成超10亿元融资_大风号
feng.ifeng.com · Original publication date not recorded
- 亿铸科技完成10亿+元融资 聚焦通用存算一体芯片
finance.sina.com.cn · Original publication date not recorded
- 仅需28nm工艺，亿铸科技打造国产十倍能效比AI芯片
finance.ifeng.com · Original publication date not recorded
Citation and coverage
Compiled and linked by Wavesight AI. Financing facts are attributable to the original disclosure sources; coverage is our recorded sample, not the whole market.
Wavesight AI｜亿铸科技 funding history。The latest disclosure recorded for 亿铸科技 is dated 2026-10-23: Undisclosed round, Lower bound: CNY 1,000,000,000. Named investors: Not disclosed. This is the latest record in our coverage, not a claim about all company financing. Compiled and linked by Wavesight AI. Financing facts are attributable to the original disclosure sources; coverage is our recorded sample, not the whole market. https://www.zkdlj.vip/en/companies/profile/EN-56a0ba67ee43de65/#conclusion-overview
Link to conclusion