AI CAPITAL INTELLIGENCE
亿铸科技 · Undisclosed round · Lower bound: CNY 1,000,000,000 · 2026-10-23
Financing facts, at a glance
亿铸科技: financing disclosed on 2026-10-23, Undisclosed round, Lower bound: CNY 1,000,000,000. Named investors: Not disclosed. This is the amount disclosed for the financing, not a company valuation or an individual investor commitment.
亿铸科技 is recorded in the AI compute & chips / AI chips & accelerators segment. The disclosed financing is Undisclosed round, with an amount of Lower bound: CNY 1,000,000,000. Investor names were not disclosed in this record.
- Disclosed company name
- 亿铸科技
- Disclosure date
- 2026-10-23
- Round
- Undisclosed round
- Financing amount
- Lower bound: CNY 1,000,000,000
- Market coverage
- China
- Sector
- AI compute & chips / AI chips & accelerators
- Product form
- Chips & compute systems
Disclosed investors
Not disclosed
Original sources
- 芯片公司亿铸科技宣布完成超10亿元融资_大风号
feng.ifeng.com · Original publication date not recorded
- 亿铸科技完成10亿+元融资 聚焦通用存算一体芯片
finance.sina.com.cn · Original publication date not recorded
- 仅需28nm工艺，亿铸科技打造国产十倍能效比AI芯片
finance.ifeng.com · Original publication date not recorded
Record reviewed as of . Reported ranges and lower bounds are retained. Financing proceeds are not company valuation.
Citation and coverage
Compiled and linked by Wavesight AI. Financing facts are attributable to the original disclosure sources; coverage is our recorded sample, not the whole market.
Wavesight AI｜亿铸科技 · Undisclosed round · Lower bound: CNY 1,000,000,000 · 2026-10-23。亿铸科技: financing disclosed on 2026-10-23, Undisclosed round, Lower bound: CNY 1,000,000,000. Named investors: Not disclosed. This is the amount disclosed for the financing, not a company valuation or an individual investor commitment. Compiled and linked by Wavesight AI. Financing facts are attributable to the original disclosure sources; coverage is our recorded sample, not the whole market. https://www.zkdlj.vip/en/funding/FI-98bf809bafca6956/#conclusion-overview
Link to conclusion